Ipc 9704 pdf
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intel board flexure guidance aligns to ipc- 9704 and ipc- 9707 standards. when an ipc publication is updated and a new revision is published, it is the opinion of the taec. download a full copy of the ipc/ jedec- 9704 guideline from the ipc web site. this document describes specific guidelines for strain gage testing for printed wiring board ( pwb) assemblies in the board manufacturing process including, assembly, test, system integration and board shipping. location: accurate strain gage rosette positioning is required to compare. 12 to 16 bit input resolution. low - pass filter. ipc/ jedecprinted wiring board strain gage test guideline. this document describes specific guidelines for strain gage testing for printed wiring board ( pwb) assemblies. sampling rate of 2khz. excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. metric: in the applicable assembly steps, diagonal strain guidance should be compared to the maximum calculated diagonal strain ( other metrics, such as principal strain should not be used). excessive strain can result in various failure modes for pdf different solder alloys, package types. ipc jedec- 9704a - ipc 9704 pdf printed circuit assembly strain gage test guideline strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. ipc/ jedec 9704a- cn- printed circuit assembly board strain gage test guidelines ( chinese version) describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration and other types of operations that may induce board flexure. it is the position of ipc s technical activities executive committee that the use and implementation of ipc publications is voluntary and is part of a relationship entered into by customer and supplier. discrete surface mount technology ( smt) devices, ( e. in the following sections of this white paper, learn about the four pcb strain gage testing steps as recommended by the ipc- 9704 guideline. printed circuit assembly strain gage test guideline. standard by association connecting electronics industries,. this guidance assumes a surface mount device; ball grid array ( bga), small outline package ( sop) and chip scale ( size) package ( pdf csp) are typical device examples. document history. the method pdf describes specific guidelines. at least 3 channels ( 12 or more recommended) simultaneous sampling of all channels. ipc jedec- 9704a – printed circuit assembly strain gage test guideline. view the most recent version. strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. ipc/ jedec- 9704. sgt system i/ o requirements. this document gathers and organizes common standards and publications relating to quality processes and methods relating to the solid- state, microelectronics, and associated industries. this document has been replaced. the document is meant to be used in conjunction with the strain gage procedure described in ipc/ jedec‐ 9704. view all product details. the suggested procedures enables board manufacturers to conduct required strain gage testing independently, and provides a quantitative method for measuring board flexure, and assessing risk levels. consultant, who ipc hub 2: 28 pm innovative ipc education and training stories: presentations of top 3 stories submitted ipc 9704 pdf to who tba 2: 46 pm introducing the global ipc in- service curriculum: an overview mandy deeves, technical officer, who ipc hub 2: 56 pm my 5 moments: the game” - revolutionizing hand hygiene education ermira tartari,. download a full copy of the ipc/ jedec- 9704 guideline from the jedec web site. printed wiring board strain gage test guideline. this document is meant to be used as a methodology for strain gage placement and subsequent testing of printed circuit assemblies ( pcas) using strain gages. this is intended to facilitate access to the applicable documents when working with electronic hardware. full description. ipc jedec- 9704a printed circuit assembly strain gage test guideline. using ipc/ jedec- 9704 & 9702 standards for strain gage testing of your printed wiring boards swapnil padhye national instruments.