Ipc a 610g deutsch pdf
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kontakt ipc ersetzt: ipc- a- 610f wam1 - februar ipc- a- 610f - juli ipc- a- 610e. de die anwender dieser richtlinie sind aufgefordert, an der entwicklung künftigerversionen mitzuarbeiten. 7105 developed ipc a 610g deutsch pdf by the ipc- a- 610 task group ( 7- 31b), ipc- a- 610 task group – europe ( 7- 31b- eu) and ipc- a- 610 task group – china ( 7- 31b- cn) of the product assurance committeeof deutsch ipc if a conflict occurs between the english language and. by piek | 16 november | categories: ipc new release | tags: ipc standard, new release. translatroman meier, dipl. übersetzt durch: tech. ipc superate: ipc- a- 610f wam1 - febbraio ipc- a- 610f - luglio ipc- a- 610e - aprile ipc- a- 610d - febbraio ipc- a- 610c - gennaio ipc- a- 610b - dicembre 1994 ipc- a- 610a - marzo 1990 ipc- a- 610 - agosto 1983 if a conflict occurs between the english and translated versions of this document, the english version will take precedence. | find, read and cite all the research you. fussel- tronic - home. 3, table 7- 4 0% of the solder destination side land area is covered with wetted solder. thomas ahrens, www. the ipc- a- 610 standard is the most widely used electronics assembly acceptance document. roman meier, www. ipc a- 610g- de-. solder destination side - land coverage solder destination side - excess solder solder in lead bend area comes in contact. this is a must- have for inspectors, operators and others with an interest in the acceptance criteria for electronic assemblies. ipc- a- 610 is developed in synergy with j- std- 001, and for ipc a 610g deutsch pdf the first time with this revision, ipc/ whma- a- 620. acceptability of electronic assemblies ( german version) ipc- a- 610 is the most widely used electronics assembly acceptance document. ‘ ‘ ipc- hdbk- 001, ‘ ‘ handbook and guide to the requirements for soldered electrical and electronic assemblies. updated with participants from 17 countries providing input and expertise, this document brings the latest criteria along with many new and revised graphics to the industry. component connectivity has been converted. ipc- a- 610g cn 电⼦ 组件的可接受性 由ipc产品保证委员会（ 7- 30） 可接受性分委员会（ 7- 31） ipc- a- 610工作组( 7- 31b) 开发 鼓励本标准的使用者参加未来修订版的开发。 联系方式： ipc 中国 取代： ipc- a- 610f附修订本1, 年2月 ipc- a- 610f， 年7月 ipc- a- 610e， 年4月 ipc- a- 610d. properly wetted solder fillet covers 100% of solder destination side land area and feathers out to a thin edge on land area. preview the ipc- a- 610g table of contents. pdf | printed circuit board ( pcb) creates platform for the majority of the electronic component placement. share this story, choose your platform! updated with participants from 17 countries providing. contact: ipc 2215 sanders road northbrook, illinoistel 847 509. subcommitteeof ipc users of this publication are encouraged to participate in the development of future revisions. ipc- a- 600g acceptability of pdf printed boards developed by the ipc- a- 600 task group ( 7- 31a) of the product assurance committeeof ipc users of this publication are encouraged to participate in the development of future revisions. 9798 supersedes:. ipc 3000 lakeside drive, suite 105n bannockburn, illinoistel 847 615. the adoption notice of the ipc- hdbk- 001 is reprinted below to better identify the department’ s intent to use ansi/ j- std- 001, ipc- hdbk- 001, and ipc- a- 610 when evaluating electronic manufacturing strategies, processes, deutsch and management. de trainalytics gmbh, dr. 7105 supersedes: ipc- a- 610c - january ipc- a- 610b - december 1994 ipc- a- 610a - march 1990 ipc- a- 610 - august 1983.